集成电路标准封装(a-f开关头)

[日期：2006-06-25]

来源：网络收集作者：佚名

[字体：大中小]

外形图	封装说明
		AC'97 v2.2 specifICation
		AGP 3.3V ACCelerated GraphICs Port SpecifICation 2.0
		AGP PRO ACCelerated GraphICs Port PRO SpecifICation 1.01
		AGP ACCelerated GraphICs Port SpecifICation 2.0
		AMR Audio/Modem Riser
		BGA Ball Grid Array
		BQFP132
		EBGA 680L
		LBGA 160L
		PBGA 217L PlastIC Ball Grid Array
		SBGA 192L
		TSBGA 680L
		C-Bend Lead
		Cerquad CeramIC Quad Flat PACk
		CLCC
		CNR CommunICation and Networking Riser Specification Revision 1.2
		CPGA CeramIC Pin Grid Array
		Ceramic Case
		LAMINATE CSP 112L Chip Scale PACkage
		DIP Dual Inline PACkage
		DIP-tab Dual Inline PACkage with Metal Heatsink
		DIMM 168
		DIMM DDR
		DIMM168 Dual In-line Memory Module
		DIMM184 For DDR SDRAM Dual In-line Memory Module
		EISA Extended ISA
		FBGA
		FDIP

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